ISSN   1004-0595

CN  62-1095/O4

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陈群, 孙见君. 自泵送流体动静压型机械密封自清洁性分析[J]. 摩擦学学报, 2019, 39(3): 259-268. DOI: 10.16078/j.tribology.2018180
引用本文: 陈群, 孙见君. 自泵送流体动静压型机械密封自清洁性分析[J]. 摩擦学学报, 2019, 39(3): 259-268. DOI: 10.16078/j.tribology.2018180
CHEN Qun, SUN Jianjun. Analysis of Self-Cleaning for Self-Pumping Hydrodynamic and Hydrostatic Mechanical Seal[J]. TRIBOLOGY, 2019, 39(3): 259-268. DOI: 10.16078/j.tribology.2018180
Citation: CHEN Qun, SUN Jianjun. Analysis of Self-Cleaning for Self-Pumping Hydrodynamic and Hydrostatic Mechanical Seal[J]. TRIBOLOGY, 2019, 39(3): 259-268. DOI: 10.16078/j.tribology.2018180

自泵送流体动静压型机械密封自清洁性分析

Analysis of Self-Cleaning for Self-Pumping Hydrodynamic and Hydrostatic Mechanical Seal

  • 摘要: 流体楔入式非接触机械密封在流体动压的形成过程中,为防止流体中固体颗粒对密封端面的损伤,需增设辅助系统以提供洁净的阻塞流体,这增加了密封初期建设和维护周期成本. 针对一种新型的泵出式自泵送流体动压型机械密封,应用Fluent中Laminar模型和DPM模型仿真研究了其在不同颗粒直径、转速、压差、液膜厚度和颗粒体积浓度下的自清洁特性. 结果表明:排屑率整体上随着颗粒体积浓度增大而减小;当颗粒体积浓度足够低时,排屑率均会达到60%以上;随着颗粒直径增大,排屑率先增大后减小,在直径0.7 μm时排屑最高达79.35%.;随着转速增大,排屑率先下降后显著上升,在计算的0~6 000 r/min范围内排屑率达到94%;排屑率受液膜厚度和压差影响较小.

     

    Abstract: In the process of forming hydrodynamic pressure, it is necessary for fluid-wedge and non-contacting mechanical seal to prepare for an auxiliary systems to provide a clean blocking fluid, which is aimed to prevent damage to the sealing end face by solid particle in the fluid. For the pump-out self-pumping fluid dynamic mechanical seal, the self-cleaning characteristics with particle diameter, rotation speed, pressure, liquid film thickness and particle volume concentration were studied by using the DPM model and the Laminar model in Fluent. The results show that the increase of volume concentration decreased the particle chip removal rate. As the particle volume concentration was low enough, the chip removal rate was hiigher than 60%. As the particle diameter increased, the chip removal rate firstly increased and then decreased. When the diameter was 0.7 μm, the chip removal was up to 79.35%. As the rotation speed increased, the chip removal rate decreased firstly and then increased significantly. The chip removal rate was 94% in the calculated range of 0~6 000 r/min. The seal pressure difference and the liquid film thickness had no obvious effect on particle chip removal rate

     

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